Merger

Recorded: 2003-01-16 Received: 2003-01-22 Pages: 14

Assignor

S & S TECHNOLOGY CORPORATION

Executed: 2002-11-07

Assignee

ULTRATERA CORPORATION

NO. 2, LI-HSIN RD. 3, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TWX, TAIWAN

Covered Properties (7)

Method for manufacturing solder mask of printed circuit board

Application: 10/155,027 →

Method for manufacturing solder mask of printed circuit board

Application: 10/155,026 →

Printed Circuit Board Having Permanent Solder Mask

Application: 10/153,852 →

Flip chip package

Application: 10/152,616 →

Wire-bonded chip on board package

Application: 10/152,770 →

Printed Circuit Board Micro Hole Processing Method

Application: 09/977,654 →

Method for Manufacturing Solder Mask of Printed Circuit Board

Application: 09/974,908 →