IP Library › Assignment 013687/0439
Patent Assignment
Reel/Frame 013687/0439

Assignment of Assignor's Interest

Recorded: 2003-01-07 Pages: 3
Assignor
STEINMANN, BETINA
Executed: 2002-12-09
Assignee
3D SYSTEMS, INC.
26081 AVENUE HALL, VALENCIA, CALIFORNIA, 91355
Covered Property (1)
Stereolithographic Resins with High Temperature and High Impact Resistance
Patent: 6,989,225 →
Application: 10/338,074 →
Publication: US 2004/0013977
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
Release of Security Interest Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →