Patent Assignment
Reel/Frame 013688/0434
Assignment of Assignor's Interest
Recorded: 2003-01-22
Received: 2003-01-28
Pages: 4
Assignor
NEC CORPORATION
Executed: 2002-12-27
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8666, JPX, JAPAN
Covered Property
(1)
Method and Apparatus for Depositing a Thin Film, and Semiconductor Device Having a Semiconductor-Insulator Junction
Application:
10/041,609 →