Patent Assignment
Reel/Frame 013732/0360
Assignment of Assignor's Interest
Recorded: 2003-02-03
Received: 2003-02-11
Pages: 3
Assignors
JIANG, TONGBI
Executed: 2003-01-23
FARNWORTH, WARREN M.
Executed: 2003-01-24
HOLLINGSHEAD, CURTIS
Executed: 2003-01-24
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, P.O. BOX 6, BOISE, ID, 83706-9632, UNITED STATES
Covered Property
(1)
Underfill Compounds Including Electrically Charged Filler Elements, Microelectronic Devices Having Underfill Compounds Including Electrically Charged Filler Elements, and Methods of Underfilling Microelectronic Devices
Application:
10/357,587 →