Patent Assignment
Reel/Frame 013733/0056
Assignment of Assignor's Interest
Recorded: 2003-02-04
Received: 2003-02-11
Pages: 2
Assignors
HOLZL, ROBERT
Executed: 2003-01-09
SEURING, CHRISTOPH
Executed: 2003-01-09
VON AMMON, WILFRIED
Executed: 2003-01-09
WAHLICH, REINHOLD
Executed: 2003-01-09
Assignee
WACKER SILTRONIC AG
JOHANNES-HESS-STRASSE 24, D 84489 BURGHAUSEN, DEX, GERMANY
Covered Property
(1)
Process for the Heat Treatment of a Silicon Wafer, and Silicon Wafer Produced
Application:
10/357,601 →