Patent Assignment
Reel/Frame 013736/0432
Assignment of Assignor's Interest
Recorded: 2003-02-10
Pages: 3
Assignors
PETERSON, ERIC C.
Executed: 2002-12-18
BOUDREAUX, BRENT A.
Executed: 2002-12-19
BELADY, CHRISTIAN L.
Executed: 2002-12-18
Assignee
HEWLETT-PACKARD COMPANY
INTELLECTUAL PROPERTY ADMINISTRATION POB 272400, FORT COLLINS, COLORADO, 80527-2400
Covered Property
(1)
Mechanical Highly Compliant Thermal Interface Pad
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2003
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 013776/0928 →
Assignment of Assignor's Interest
Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
Patent Assignment, Security Interest, and Lien Agreement
Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
Assignment of Assignor's Interest
Feb 24, 2021
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 055403/0001 →