Patent Assignment
Reel/Frame 013749/0909
Assignment of Assignor's Interest
Recorded: 2003-02-06
Received: 2003-02-14
Pages: 5
Assignors
CHOW, SENG GUAN
Executed: 2003-01-24
RAMAKRISHNA, KAMBHAMPATI
Executed: 2003-01-24
SHIM, IL KWON
Executed: 2003-01-24
Assignee
ST ASSEMBLY TEST SERVICES PTE LTD
5 YISHUN STREET 23, SINGAPORE 768442, SGX, SINGAPORE
Covered Property
(1)
Thermally Enhanced Stacked Die Package
Application:
10/359,407 →