Patent Assignment
Reel/Frame 013757/0176
Assignment of Assignor's Interest
Recorded: 2003-02-13
Received: 2003-02-20
Pages: 2
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(2)
Power Seat Drive Motor Mounting Arrangement and Assembly Method
Application:
10/298,186 →
Conductive Hardening Resin for a Semiconductor Device and Semiconductor Device Using the Same
Application:
10/052,633 →