Patent Assignment
Reel/Frame 013770/0965
Assignment of Assignor's Interest
Recorded: 2003-02-13
Received: 2003-02-25
Pages: 2
Assignors
OKUDA, HIDEKAZU
Executed: 2002-10-24
TACHIKAWA, KOSAKU
Executed: 2002-10-29
NAKABAYASHI, SHINICHI
Executed: 2002-11-06
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Method of manufacturing semiconductor integrated circuit device
Application:
10/365,421 →