Patent Assignment
Reel/Frame 013777/0911
Assignment of Assignor's Interest
Recorded: 2003-02-25
Received: 2003-02-27
Pages: 2
Assignor
HEDLER, HARRY
Executed: 2002-02-10
Assignee
INFINEON TECHNOLOGIES AG
RIDLERSTRASSE 55, PATENTABTEILUNG, MUENCHEN, DEX, 80339, GERMANY
Covered Property
(1)
Electronic Configuration with Flexible Bonding Pads
Application:
10/022,606 →