Patent Assignment
Reel/Frame 013789/0946
Assignment of Assignor's Interest
Recorded: 2003-02-24
Pages: 3
Assignors
NAKANO, MASAHIRO
Executed: 2003-01-09
GUNJI, KATSUHIKO
Executed: 2003-01-09
OIKAWA, YASUNOBU
Executed: 2003-01-09
SATO, KATSUO
Executed: 2003-01-09
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device
Application:
10/298,228 →
Publication:
US 2003/0137039
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.