Patent Assignment
Reel/Frame 013826/0613
Assignment of Assignor's Interest
Recorded: 2003-03-10
Received: 2003-03-13
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(2)
Flip- Chip Semiconductor Device and Method of Forming the Same
Application:
09/779,627 →
Layout Design Method
Application:
09/768,594 →