Patent Assignment
Reel/Frame 013832/0778
Assignment of Assignor's Interest
Recorded: 2003-03-13
Received: 2003-03-14
Pages: 3
Assignor
HANAWA, TAKESHI
Executed: 2002-12-20
Assignee
NOKIA CORPORATION
KEILALAHDENTIE 4, ESPOO, FIX, FIN-02150, FINLAND
Covered Property
(1)
Radio Frequency Integrated Circuit Having Increased Substrate Resistance Enabling Three Dimensional Interconnection with Feedthroughs
Application:
10/328,213 →