Patent Assignment
Reel/Frame 013836/0931
Assignment of Assignor's Interest
Recorded: 2003-07-28
Received: 2003-07-28
Pages: 5
Assignors
ALVAREZ, SHEILA MARIE L.
Executed: 2003-05-07
ARORAO, VIRGIL COTOCO
Executed: 2003-05-07
CHOW, SENG GUAN
Executed: 2003-05-07
EMIGH, ROGER
Executed: 2003-05-07
SHIM, KWON, II
Executed: 2003-05-07
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Property
(1)
Heat Spreaders, Heat Spreader Packages, and Fabrication Methods for Use with Flip Chip Semiconductor Devices
Application:
10/434,256 →