Patent Assignment
Reel/Frame 013846/0119
Assignment of Assignor's Interest
Recorded: 2003-03-07
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Light Thin Stacked Package Semiconductor Device and Process for Fabrication Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.