Patent Assignment
Reel/Frame 013856/0343
Assignment of Assignor's Interest
Recorded: 2003-03-18
Received: 2003-03-21
Pages: 3
Assignor
HORIKAWA, TSUYOSHI
Executed: 2001-08-17
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
09/954,021 →