Patent Assignment
Reel/Frame 013859/0012
Assignment of Assignor's Interest
Recorded: 2003-03-12
Received: 2003-03-21
Pages: 2
Assignors
HSIEH, HAN-KUN
Executed: 2003-02-25
LIN, WEI-FENG
Executed: 2003-02-25
HSIEH, YI-CHANG
Executed: 2003-02-27
Assignee
SILICON INTEGRATED SYSTEMS CORP.
NO. 16 CREATION RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TWX, R.O.C., TAIWAN
Covered Property
(1)
Chip-Packaging Substrate and Test Method Therefor
Application:
10/385,681 →