Patent Assignment
Reel/Frame 013892/0371
Assignment of Assignor's Interest
Recorded: 2003-03-19
Pages: 2
Assignors
GIARETTA, GIORGIO
Executed: 2003-03-17
NGUYEN, THE' LINH
Executed: 2003-03-17
HOFMEISTER, RUDOLF J.
Executed: 2003-03-17
Assignee
FINISAR CORPORATION
1308 MOFFETT PARK DRIVE, SUNNYVALE, CALIFORNIA, 94089-1133
Covered Property
(1)
Submount, Pedestal, and Bond Wire Assembly for a Transistor Outline Package with Reduced Bond Wire Inductance
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 19, 2003
From: LIPSON, JAN
To: FINISAR CORPORATION
Reel/Frame 014198/0929 →
Notice of Grant of Security Interest in Patents
Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Assignment of Assignor's Interest
Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
Security Interest
Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
Patent Release and Reassignment
Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →