Patent Assignment
Reel/Frame 013897/0080
Security Interest
Recorded: 2003-08-19
Received: 2003-08-20
Pages: 40
Assignee
DEUTSCHE BANK AG, NEW YORK BRANCH, AS AGENT
31 WEST 52ND ST., NEW YORK, NY, 10019, UNITED STATES
Covered Properties
(46)
High functional polymers
Application:
10/416,101 →
Three-Dimensional Structured Printing
Application:
10/399,444 →
Seamless Model and Method of Making a Seamless Model
Application:
10/380,392 →
Filled epoxy resin system having high mechanical strength values
Application:
10/433,137 →
Positive Type Photosensitive Epoxy Resin Composition and Printed Circuit Board Using the Same
Application:
10/416,978 →
Epoxy Resin Composition
Application:
10/182,412 →
High functional polymers
Application:
10/332,597 →
Coherent insert
Application:
10/258,204 →
Photocurable compositions with phosphite viscosity stabilizers
Application:
10/283,233 →
Water-based material systems and methods for 3D printing
Application:
10/225,830 →
Process for the Preparation of Reaction Products of Cycloaliphatic Epoxides with Multifunctional Hydroxy Compounds
Application:
10/018,667 →
Curable composition
Application:
10/208,460 →
Uv-Curable Compositions
Application:
10/088,564 →
Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
Application:
10/167,436 →
Photocurable compositions with alicyclic epoxides of high monomer purity
Application:
10/143,907 →
Photocurable compositions containing reactive polysiloxane particles
Application:
10/125,508 →
Curable composition
Application:
10/031,135 →
Poly(9,9'-Spirobisfluorenes), Their Production and Their Use
Application:
10/096,926 →
Bonding of concrete parts
Application:
10/069,164 →
Polymercaptopolyamines as Epoxy Resin Hardeners
Application:
10/031,983 →
Filler Mixtures
Application:
10/031,134 →
Nanocomposites
Application:
10/031,108 →
Method of Treating an Aluminum Surface
Application:
10/002,181 →
Amine-Modified Epoxy Resin Reacted in Presence of Latent Hardener
Application:
09/986,815 →
Photosensitive Composition
Application:
10/019,910 →
Matting Agents for Thermally Curable Systems
Application:
09/937,001 →
Photosensitive Diacrylate and Dimethacrylate Compositions
Application:
09/953,250 →
Hardenable Composition with a Particular Combination of Characteristics
Application:
09/936,706 →
Epoxy Resin Compositions Having a Long Shelf Life
Application:
09/936,710 →
Epoxy Acrylate of Aromatic Biphenol-Advanced Epoxy Resin Reacted with Anhydride
Application:
09/932,731 →
Melamine-Modified Phyllosilicates
Application:
09/890,213 →
Thermosetting poly urethane/urea-forming compositions
Application:
09/868,289 →
Production of Photoresist Coatings
Application:
09/868,817 →
Transaminated Dialkylaminoalkylphenol-3 and 1 Amine-Containing Compound
Application:
09/787,165 →
Hydrophobic Epoxide Resin System
Application:
09/857,684 →
Crosslinking Agent for Carboxyl-Containing Polymers in Heat-Curable Systems
Application:
09/856,116 →
Method for Producing Multi-Layer Circuits
Application:
09/787,221 →
Method for Producing Etched Circuits
Application:
09/787,220 →
Method of Coating Both Sides of Printed Circuit Boards Having Holes
Application:
09/719,803 →
Heat Curable Epoxy Compositions
Application:
09/743,378 →
Pack for two component product and method of making it
Application:
09/762,909 →
Pack
Application:
09/762,908 →
Liquid, radiation-curable composition, especially for stereolithography
Application:
09/776,656 →
Cyanate Esters Having Flame Resistant Properties
Application:
09/773,305 →
Rotary Trowel for Use in the Molding of Ceramics and Method for Production Thereof
Application:
09/744,228 →
Flowable Glanulates
Application:
09/743,501 →