Patent Assignment
Reel/Frame 013921/0332
Assignment of Assignor's Interest
Recorded: 2003-04-01
Pages: 2
Assignor
OHUCHI, RIEKA
Executed: 2003-03-24
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Flip-Chip Semiconductor Device Utilizing an Elongated Tip Bump
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.