Patent Assignment
Reel/Frame 013927/0759
Assignment of Assignor's Interest
Recorded: 2003-03-31
Pages: 2
Assignors
KOIKE, KESAHIRO
Executed: 2003-03-27
OHTSUKA, MASATO
Executed: 2003-03-27
TOCHIHARA, YASUTAKA
Executed: 2003-03-27
Assignee
HOYA CORPORATION
7-5, NAKA-OCHIAI 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Determining a Flatness of an Electronic Device Substrate, Method of Producing the Substrate, Method of Producing a Mask Blank, Method of Producing a Transfer Mask, Polishing Method, Electronic Device Substrate, Mask Blank, Transfer Mask, and Polishing App