Patent Assignment
Reel/Frame 013946/0303
Assignment of Assignor's Interest
Recorded: 2003-04-04
Received: 2003-04-15
Pages: 3
Assignors
HOSOGANE, AKIRA
Executed: 2003-03-19
KOKUBO, NOBUYUKI
Executed: 2003-03-19
TOMITA, HIDEMOTO
Executed: 2003-03-19
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Semiconductor Circuit Device with Mitigated Load on Interconnection Line
Application:
10/406,461 →