Assignment of Assignor's Interest

Recorded: 2003-04-21 Received: 2003-04-23 Pages: 2

Assignors

HOGERL, JURGEN

Executed: 2001-04-23

PAULUS, STEFAN

Executed: 2001-04-23

Assignee

INFINEON TECHNOLOGIES AG

RIDLERSTRASSE 55, PATENTABTEILUNG, MUENCHEN, DEX, 80339, GERMANY

Covered Properties (2)

Modular Headliner Assembly and Method of Making Same

Application: 10/297,116 →

Housing for Semiconductor Chips

Application: 09/832,246 →