Patent Assignment
Reel/Frame 013976/0493
Assignment of Assignor's Interest
Recorded: 2003-04-15
Received: 2003-04-23
Pages: 2
Assignors
MATSUURA, NOBUYOSHI
Executed: 2003-03-01
KOUNO, YASUHIKO
Executed: 2003-03-05
KUBO, MASAHARU
Executed: 2003-03-10
MIURA, HIDEO
Executed: 2003-03-17
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Wafer and Manufacturing Method of Semiconductor Device
Application:
10/413,562 →