Patent Assignment
Reel/Frame 013992/0776
Assignment of Assignor's Interest
Recorded: 2003-09-19
Pages: 3
Assignors
BERR, ANDREW H.
Executed: 2003-06-04
POMARANSKI, KEN G.
Executed: 2003-06-04
SHIDLA, DALE J
Executed: 2003-06-04
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
Apparatus and Method for Monitoring High Impedance Failures in Chip Interconnects
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
Patent Assignment, Security Interest, and Lien Agreement
Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
Assignment of Assignor's Interest
May 6, 2021
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 056157/0492 →