Patent Assignment
Reel/Frame 013993/0534
Assignment of Assignor's Interest
Recorded: 2003-04-23
Received: 2003-04-29
Pages: 2
Assignors
OHBU, ISAO
Executed: 2001-04-11
OKA, TOHRU
Executed: 2001-04-11
TAKAZAWA, HIROYUKI
Executed: 2001-04-11
IMAMURA, YOSHINORI
Executed: 2001-04-16
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Properties
(2)
Semiconductor Device and Power Amplifier Using the Same
Application:
10/420,764 →
Heated Filling Device
Application:
10/026,135 →