Patent Assignment
Reel/Frame 013994/0685
Assignment of Assignor's Interest
Recorded: 2003-04-22
Pages: 2
Assignors
HUANG, CHEIN-PING
Executed: 2002-12-30
WANG, YU-PO
Executed: 2002-12-30
HUANG, CHIH-MING
Executed: 2002-12-30
Assignee
SILICONWARE PRECISION INDUSTRIES CO. LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANSTZU, TAICHUNG, R.O C., TAIWAN
Covered Property
(1)
Semiconductor Package Free of Substrate and Fabrication Method Thereof