Patent Assignment
Reel/Frame 014021/0456
Assignment of Assignor's Interest
Recorded: 2003-10-01
Pages: 3
Assignors
KIM, WOOJIN
Executed: 2003-09-30
DANCASTER, JOHN
Executed: 2003-09-30
LOGAN, JOHN
Executed: 2003-09-30
BRYZEK, ANIELA
Executed: 2003-09-30
Assignee
GENERAL ELECTRIC COMPANY
41 WOODFORD AVENUE, PLAINVILLE, CONNECTICUT, 06062
Covered Property
(1)
Surface Mount Package and Method for Forming Multi-Chip Microsensor Device
Patent:
6,927,482 →
Application:
10/605,472 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2014
From: GENERAL ELECTRIC COMPANY
To: AMPHENOL CORPORATION
Reel/Frame 032679/0265 →
Assignment of Assignor's Interest
Apr 24, 2014
From: AMPHENOL CORPORATION
To: GE THERMOMETRICS, INC.
Reel/Frame 032745/0924 →
Change of Name
Apr 25, 2014
From: GE THERMOMETRICS, INC.
To: AMPHENOL THERMOMETRICS, INC.
Reel/Frame 032763/0141 →