Assignment of Assignor's Interest

Recorded: 2003-05-02 Received: 2003-05-07 Pages: 5

Assignor

SOLUTIA INC.

Executed: 2003-01-31

Assignee

UCB CHIP INC.

300 DELAWARE AVENUE, SUITE 1297, WILMINGTON, DE, 19801, UNITED STATES

Covered Properties (12)

Process for Forming Solid Pressure Sensitive Adhesive Polymer Microspheres

Application: 10/272,409 →

Removable, water-whitening resistant pressure sensitive adhesives

Application: 60/413,846 →

Removable, water-whitening resistant pressure sensitive adhesives

Application: 60/413,786 →

Process for Improving Water-Whitening Resistance of Pressure Sensitive Adhesives

Application: 10/154,081 →

Process for Improving Water-Whitening Resistance of Pressure Sensitive Adhesives

Application: 10/142,455 →

Polymerization Process

Application: 10/118,811 →

Waterfast ink jet inks containing a UV curable resin

Application: 10/075,438 →

Process for Forming Solid Pressure Sensitive Adhesive Polymer Microspheres

Application: 09/886,729 →

Adhesive compositions

Application: 09/885,198 →

Polyoxazoline Compounds and Their Use in Surface Coating Compositions

Application: 09/831,067 →

Alkoxymethyl melamine crosslinkers

Application: 09/783,233 →

Environmentally Safe Paint Stripper

Application: 09/768,408 →