Assignment of Assignor's Interest

Recorded: 2003-05-16 Received: 2003-05-20 Pages: 4

Assignors

IYER, MAHADEVAN K

Executed: 2003-03-13

KHAN, NAVAS O.K.

Executed: 2003-03-13

YEO, YONG KEE

Executed: 2003-03-13

Assignee

INSTITUTE OF MICROELECTRONICS

11 SCIENCE PARK ROAD, SINGAPORE SCIENCE PARK, SINGAPORE, JPX, 117685, JAPAN

Covered Properties (2)

Enhanced Chip Scale Package for Wire Bond Dies

Application: 10/078,718 →

Credit inquiry method and system

Application: 10/035,246 →