Patent Assignment
Reel/Frame 014076/0497
Assignment of Assignor's Interest
Recorded: 2003-05-20
Pages: 8
Assignors
BHAGAVAT, MILIND S.
Executed: 2003-04-11
WITTE, DALE A.
Executed: 2003-04-11
KIMBEL, STEVEN L.
Executed: 2003-04-11
SAGER, DAVID A.
Executed: 2003-04-10
PEYTON, JOHN W.
Executed: 2003-04-11
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, P.O. BOX 8, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Method and apparatus for slicing semiconductor wafers
Application:
10/377,271 →
Publication:
US 2003/0170948