Patent Assignment
Reel/Frame 014088/0381
Assignment of Assignor's Interest
Recorded: 2003-05-21
Pages: 9
Assignors
TANABE, KAZUHIKO
Executed: 2003-04-04
TERADA, HIROAKI
Executed: 2003-04-16
SUGIURA, MASAHIRO
Executed: 2003-05-01
MIZUTANI, TETSUHARU
Executed: 2003-04-25
IMAMURA, KEIICHIRO
Executed: 2003-03-31
TANAKA, TAKASHI
Executed: 2003-03-24
Assignees
NEC INFRONTIA CORPORATION
6-1, KITAMIKATA 2-CHOME, TAKATSU-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
NEC TOPPAN CIRCUIT SOLUTIONS TOYOMA, INC.
560 NYUZEN, NYUZEN-MACHI, SHIMONIIKAWA-GUN, TOYAMA, JAPAN
SOLDERCOAT CO., LTD.
75-1, AZA CHOTA, NARUMI-CHO MIDORI-KU, NAGOYA-SHI, AICHI, JAPAN
MARUYA SEISAKUSHO CO., LTD.
54, HOSOKI-CHO 2-CHOME, KASUGAI-SHI, AICHI, JAPAN
NIHON DEN-NETSU KEIKI CO., LTD.
27-1, SHIMOMARUKO 2-CHOME, OTA-KU, TOKYO, JAPAN
Covered Property
(1)
Soldering Method and Solder Joint Member