Assignment of Assignor's Interest

Recorded: 2003-05-28 Pages: 2

Assignors

FURUSAWA, TAKESHI

Executed: 2003-05-13

MACHIDA, SHUNTARO

Executed: 2003-05-08

RYUZAKI, DAISUKE

Executed: 2003-05-08

Assignee

HITACHI, LTD.

6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Property (1)

Method of manufacturing a semiconductor device for high speed operation and low power consumption

Application: 10/447,148 →

Publication: US 2004/0048203

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.