IP Library › Assignment 014164/0266
Patent Assignment
Reel/Frame 014164/0266

Assignment of Assignor's Interest

Recorded: 2003-06-13 Received: 2003-06-17 Pages: 4
Assignor
Assignee
GE SPECIALTY MATERIALS JAPAN CO., LTD.
GESM - QUARTZ PATENTS, ONE RIVER ROAD, SCHENECTADY, NY, 12345, UNITED STATES
Covered Properties (3)
Semiconductor Package Having Optimized Wire Bond Positioning
Application: 10/457,632 →
Wafer handling apparatus and method of manufacturing the same
Application: 10/198,052 →
Electrostatic Chuck and Method of Manufacturing the Same
Application: 10/006,657 →