Patent Assignment
Reel/Frame 014183/0405
Assignment of Assignor's Interest
Recorded: 2003-06-16
Pages: 3
Assignor
TAKAHASHI, KUNIAKI
Executed: 2003-06-02
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1 SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Lead-Free Solder Alloy and Lead-Free Solder Paste Using the Same