Patent Assignment
Reel/Frame 014190/0106
Assignment of Assignor's Interest
Recorded: 2003-12-11
Received: 2003-12-11
Pages: 3
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Properties
(13)
Method a Making a Semiconductor Having Multi-Layered Electrodes Including Nickel and Phosphorous and Solder Formed with Tin and an Alkaline Earth Metal
Application:
10/358,191 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
10/325,908 →
Data processor
Application:
10/302,846 →
Method of Manufacturing a Semiconductor Device
Application:
10/269,972 →
Semiconductor Device with an Input/Output Interface Circuit for a Bus
Application:
10/256,025 →
Method of Manufacturing a Semiconductor Device
Application:
10/247,505 →
A Method of Manufacturing a Semiconductor Device in Which a Block Molding Package Utilizes Air Vents in a Substrate
Application:
10/195,084 →
Semiconductor Device Having Electrodes Containing at Least Copper, Nickel, Phosphorus and Tin
Application:
10/173,715 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
10/123,242 →
Microcomputer with Mode-Controlled Memory
Application:
10/080,665 →
Microcomputer, programming method and erasing method
Application:
10/080,681 →
Microcomputer and Data Processing Device
Application:
10/079,619 →
Data Processing System and Data Processing Method
Application:
09/938,629 →