Patent Assignment
Reel/Frame 014200/0358
Corrective Assignment to Add Assignee Name, Previously Recorded on Reel 013651 Frame 0959.
Recorded: 2003-12-16
Received: 2003-12-16
Pages: 5
Assignors
BOMBONATI, MAURO
Executed: 2003-01-02
MARCHI, MAURO
Executed: 2003-01-02
MASTROMATTEO, UBALDO
Executed: 2003-01-02
MORIN, DANIELA
Executed: 2003-01-02
MOTTURA, MARTA
Executed: 2003-01-02
Assignees
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, I-20041 AGRATE BRIANZA, ITX, ITALY
HEWLETT-PACKARD COMPANY
11413 CHINDEN BOULEVARD, BOISE, ID, 83714, UNITED STATES
Covered Property
(1)
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
Application:
10/243,972 →