Patent Assignment
Reel/Frame 014223/0345
Assignment of Assignor's Interest
Recorded: 2003-06-20
Received: 2003-07-07
Pages: 4
Assignors
LOW, QWAI H.
Executed: 2003-06-12
RANGANAGTAN, RAMASWAMY
Executed: 2003-06-12
FULCHER, EDWIN M.
Executed: 2003-06-20
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, M/S D106, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
Bonding Pad for Low K Dielectric
Application:
10/600,255 →