Patent Assignment
Reel/Frame 014229/0888
Assignment of Assignor's Interest
Recorded: 2004-01-05
Pages: 3
Assignors
CHEN, KAI-CHI
Executed: 2003-10-29
HUANG, SHU-CHEN
Executed: 2003-10-29
LI, HSUN-TIEN
Executed: 2003-10-29
LEE, TZONG-MING
Executed: 2003-10-29
FUKUI, TARO
Executed: 2003-10-29
NEMOTO, TOMOAKI
Executed: 2003-10-29
Assignees
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SECTION4, CHUNG HSING ROAD, CHUTUNG,, HSINCHU, TAIWAN
MATSUSHITA ELECTRIC WORKS, LTD.
1048, OAZA-KADOMA, KADOMA-SHI, OSAKA, JAPAN
Covered Property
(1)
[Chip Package Structure and Process for Fabricating the Same]
Application:
10/707,687 →
Publication:
US 2004/0212080
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.