IP Library Assignment 014251/0215
Patent Assignment
Reel/Frame 014251/0215

Assignment of Assignor's Interest

Recorded: 2003-07-02 Pages: 2
Assignor
KATO, TOMOKI
Executed: 2003-07-02
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Molded Resin Semiconductor Device Having Exposed Semiconductor Chip Electrodes
Patent: 7,199,455 →
Application: 10/610,648 →
Publication: US 2004/0065953
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0145 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →