Patent Assignment
Reel/Frame 014265/0226
Assignment of Assignor's Interest
Recorded: 2003-06-27
Pages: 3
Assignors
MIWA, TAKASHI
Executed: 2003-05-16
TSUTSUMI, YASUMI
Executed: 2003-05-28
ICHITANI, MASAHIRO
Executed: 2003-05-26
HASHIZUME, TAKANORI
Executed: 2003-05-26
SATO, MASAMICHI
Executed: 2003-05-28
MORINO, NAOZUMI
Executed: 2003-05-28
NAKAMURA, ATSUSHI
Executed: 2003-05-29
TAMAKI, SANEAKI
Executed: 2003-05-27
KUDO, IKUO
Executed: 2003-05-29
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Stacked Large-Scale Integrated Circuit (Lsi) Semiconductor Device with Miniaturization and Thinning of Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.