Patent Assignment
Reel/Frame 014279/0456
Assignment of Assignor's Interest
Recorded: 2003-07-10
Pages: 3
Assignors
LEE, SEOK-KYU
Executed: 2003-06-13
KANG, JANG-KYU
Executed: 2003-06-13
JIN, HYUN-JU
Executed: 2003-06-11
MIN, BYOUNG-YOUL
Executed: 2003-06-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN-3DONG, PALDAL-GU, SUWON-SI KYUNGGI-DO 442-743 REPUBLIC OF, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board with Embedded Capacitors Therein, and Process for Manufacturing the Same