IP Library › Assignment 014291/0205
Patent Assignment
Reel/Frame 014291/0205

Assignment of Assignor's Interest

Recorded: 2003-07-14 Pages: 2
Assignors
BRANDENBURG, SCOTT D.
Executed: 2003-07-08
LAUDICK, DAVID A.
Executed: 2003-07-08
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE: 480-410-202 P.O. BOX 5052, TROY, MICHIGAN
Covered Property (1)
Wafer Applied Thermally Conductive Interposer
Patent: 6,875,636 →
Application: 10/618,953 →
Publication: US 2005/0014312
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Release of Security Agreement Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →