Patent Assignment
Reel/Frame 014330/0387
Assignment of Assignor's Interest
Recorded: 2003-03-17
Pages: 2
Assignors
UNO, TOMOHIRO
Executed: 2003-02-25
TERASHIMA, SHINICHI
Executed: 2003-02-25
TATSUMI, KOHEI
Executed: 2003-02-25
Assignee
NIPPON STEEL CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO 100-8071, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device and Method for Producing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Address
Aug 23, 2018
From: NIPPON STEEL CORPORATION
To: NIPPON STEEL & SUMITOMO METAL CORPORATION
Reel/Frame 046918/0854 →
Assignment of Assignor's Interest
Aug 23, 2018
From: NIPPON STEEL & SUMITOMO METAL CORPORATION
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 046682/0754 →
Merger and Change of Name
Mar 18, 2020
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 052188/0275 →