Patent Assignment
Reel/Frame 014358/0224
Assignment of Assignor's Interest
Recorded: 2003-07-30
Pages: 2
Assignors
NEMOTO, YOSHIHIKO
Executed: 2003-06-23
FUJII, TOMONORI
Executed: 2003-06-30
SUNOHARA, MASAHIRO
Executed: 2003-07-08
SATO, TOMOTOSHI
Executed: 2003-07-17
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
SHARP KABUSHIKI KAISHA
22-22, NAGAIKE-CHO, ABENO-KU, OSAKA-SHI, OSAKA, JAPAN
TAIYO YUDEN CO., LTD
16-20, UENO 6-CHOME, TAITO-KU, TOKYO 110-0005, JAPAN
SHINKO ELECTRIC INDUSTRIES CO., LTD.
711, AZA SHARIDEN, OAZA KURITA, NAGANO-SHI, NAGANO, 380-0921, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device with Penetration Electrodes That Protrude from a Rear Side of a Substrate Formed by Thinning the Substrate
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 29, 2005
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016823/0947 →
Change of Name
Sep 15, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024990/0492 →
Assignment of Assignor's Interest
Mar 14, 2016
From: SHARP KABUSHIKI KAISHA
To: TAIYO YUDEN CO., LTD.; SHINKO ELECTRIC INDUSTRIES CO., LTD.; RENESAS ELECTRONICS CORPORATION
Reel/Frame 037972/0076 →
Corrective Assignment to Correct the Address of the Third Assignee Previously Recorded on Reel 065781 Frame 0014. Assignor(S) Hereby Confirms the the Assignment.
Apr 15, 2016
From: SHARP KABUSHIKI KAISHA
To: TAIYO YUDEN CO., LTD.; SHINKO ELECTRIC INDUSTRIES CO., LTD.; RENESAS ELECTRONICS CORPORATION
Reel/Frame 038439/0833 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →