Patent Assignment
Reel/Frame 014362/0039
Assignment of Assignor's Interest
Recorded: 2004-02-20
Received: 2004-02-20
Pages: 4
Assignor
OMG AMERICAS, INC.
Executed: 2003-08-27
Assignee
HAMMOND GROUP, INC.
1414 FIELD STREET, HAMMOND, IN, 46320, UNITED STATES
Covered Properties
(2)
Method of Balanced Coefficient of Thermal Expansion for Flip Chip Ball Grid Array
Application:
10/631,328 →
Liquid Overbased Mixed Metal Stabilizer Composition of Calcium, Barium and Zinc for Stabilizing Halogen-Containing Polymers
Application:
10/097,724 →