Patent Assignment
Reel/Frame 014364/0972
Assignment of Assignor's Interest
Recorded: 2003-07-31
Pages: 4
Assignee
MOTOROLA, INC.
1303 EAST ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196
Covered Property
(1)
Wafer-Level Sealed Microdevice Having Trench Isolation and Methods for Making the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.