IP Library › Assignment 014378/0506
Patent Assignment
Reel/Frame 014378/0506

Assignment of Assignor's Interest

Recorded: 2003-04-30 Pages: 2
Assignors
NARITA, SHORIKI
Executed: 2003-03-05
IKEYA, MASAHIKO
Executed: 2003-03-05
TSUBOI, YASUTAKA
Executed: 2003-03-05
MAE, TAKAHARU
Executed: 2003-03-05
KANAYAMA, SHINJI
Executed: 2003-03-05
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property (1)
Bump Formation Method and Bump Forming Apparatus for Semiconductor Wafer
Patent: 7,052,984 →
Application: 10/415,587 →
Publication: US 2004/0020973
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021930/0876 →
Assignment of Assignor's Interest Feb 10, 2014
From: PANASONIC CORPORATION (FORMERLY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.)
To: GODO KAISHA IP BRIDGE 1
Reel/Frame 032209/0630 →