IP Library Assignment 014420/0560
Patent Assignment
Reel/Frame 014420/0560

Cert. Copy of All Past Records W/Translation

Recorded: 2003-08-25 Pages: 10
Assignor
JSP CORPORATION
Executed: 2003-08-01
Assignee
JSP CORPORATION
4-2, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (12)
Process for the Production of Expanded Particles of a Polyolefin Resin
Patent: 5,071,883 →
Application: 07/573,805 →
Process for Producing Foamed Body of Polycarbonate Resin and Foamed Body Obtained Thereby
Patent: 5,854,294 →
Application: 08/783,206 →
Composite Material Having Polypropylene Foam Layer
Patent: 5,928,776 →
Application: 08/967,362 →
Composite Material Having Polypropylene Resin Molded Body and Polypropylene Resin Foamed Body and Method of Producing Same
Patent: 6,096,417 →
Application: 09/173,739 →
Foamed Particles of Cross-Linked Aliphatic Polyester Resins, Process for Producing Them, and Foamed Moldings Obtained from Them
Patent: 6,110,983 →
Application: 09/424,066 →
Polycarbonate Resin Foam and Shock Absorber Using the Same
Patent: 6,191,178 →
Application: 09/601,236 →
Composite Sheet Having Foamed Polycarbonate Resin Layer and Non-Foamed Polycarbonate Resin Layer
Patent: 6,492,015 →
Application: 09/671,749 →
Method for Production of Extruded, Polystyrene-Based Resin Foam Plate and Extruded Foam Plate Obtained Thereby
Patent: 7,008,578 →
Application: 10/170,706 →
Publication: US 2003/0124334
Extruded, polystyrene-based resin foam plate and method for the production thereof
Application: 10/170,725 →
Publication: US 2003/0042644
Foamed and Expanded Beads of Polyester-Based Resin and Foam Molding Obtained Therefrom
Patent: 6,686,400 →
Application: 10/190,549 →
Publication: US 2003/0119928
Method of producing composite material having foamed resin layer and surface layer
Application: 10/333,356 →
Publication: US 2003/0171455
Expanded Polypropylene Resin Bead and Process of Producing Same
Patent: 6,956,067 →
Application: 10/379,569 →
Publication: US 2003/0162012
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 1, 2004
From: SASAKI, HIDEHIRO; HIRA, AKINOBU; HASHIMOTO, KEIICHI; TOKORO, HISAO
To: JSP CORPORATION
Reel/Frame 015317/0917 →