IP Library › Assignment 014458/0791
Patent Assignment
Reel/Frame 014458/0791

Assignment of Assignor's Interest

Recorded: 2004-03-24 Pages: 4
Assignor
HITACHI, LTD.
Executed: 2004-02-02
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Method of Manufacturing a Resin Molded or Encapsulation for Small Outline Non-Leaded (Son) or Quad Flat Non-Leaded (Qfn) Package
Patent: 6,897,093 →
Application: 10/626,670 →
Publication: US 2004/0104490
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →